Re: Metal thin film preparation on solid surfaces
From: Gregory L. Hansen (glhansen_at_steel.ucs.indiana.edu)
Date: 11/27/04
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Date: Sat, 27 Nov 2004 23:51:13 +0000 (UTC)
In article <d6dc02d5.0411270426.657d126d@posting.google.com>,
jigges <jigges@rediffmail.com> wrote:
>We use to make thin gold films on solid supports as our routine work
>(for details, see below). I am interested in preparing similar metal
>films, but with other metals (e.g., Platinum, Palladium, Copper,
>Zinc). Can anybody please inform me anything about this? Or, is there
>any reference where I can get these procedures, including the source
>of the metals, rigid support (if something other than silicon wafers &
>glass microscope cover slips are needed), boats, pressure, temperature
>(required Voltage & Ampere), etc.
I suspect you won't get many useful replies, so I'll give you what meager
knowledge I have. I haven't actually created thin films myself.
You can get raw materials and other supplies from the Kurt J. Lesker
Company, Alpha Aesar, Sierra Applied Sciences, and surely others.
Copper still needs a glue layer on silicon. I know titanium and aluminum
are used. I guess the trick is that the Ti or Al are oxygen active and
bond to the silica surface, and alloys with the copper so that the copper
sticks to the other side. If needed, an oxygen plasma can prepare an
oxide layer on the silicon. Copper alloys with gold and it's in the same
period as gold, so if a molybdenum boat worked with gold (meaning
material from the boat didn't dissolve into or react with the gold and
contaminate the coating) I would guess it would work with copper. And I
would guess that chromium would still work as a glue layer. But I'm
talking out of my ass at this point.
I don't know what to say about the other metals, or the power supply.
There are handbooks on thin film deposition that should be available at
research libraries, and surely the listed suppliers would know something
about it.
>
>Procedure for preparing gold films : Silicon wafers & glass microscope
>cover slips were used as a rigid support for thin gold films. Pure
>(99.99%) gold granules and pure (99.9%) chromium crystals (Aldrich,
>USA) were deposited onto silicon wafers and glass cover slips by
>vapour deposition under vacuum (10-6 Torr). A thin chromium adhesion
>layer is necessary to ensure that the thin gold film does not
>delaminate from the underlying support. Chromium and gold are
>successively evaporated without pressurizing the chamber. The gold was
>evaporated from a molybdenum boat (ProSciTech, Australia) at 120-140 V
>and 50 A. The chromium was evaporated from a tungsten boat
>(ProSciTech, Australia) at 250 V and 15 A. These thin gold films were
>used to prepare self-assembled monolayers.
>
>Regards,
>Jigges
-- "And don't skimp on the mayonnaise!"
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