EMI, Cross Talk, Ground Bounce

I am sure you all know the myriad of problems that can plague a digital circuit on a PCB, most through the fault of that phenomenon called
INDUCTANCE!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!

I am trying to change the way I lay out circuits on double sided PCB's that I build at home.

I have reading up on signal integrity issues and learning that perhaps the way I have been doing things are flawed - ok TERRIBLY flawed.

The question I have for the gurus on here is this?:
assuming a situation where I dont go with the ideal layout method of seperate ground and power planes (a 3 - 4 layer board minimum) is there a way to get some of those sort of benefits on a two layer design?

I can only build double sided boards at home, so any suggestions on optimal ways/methods of laying out signal/power/gnd tracks and vias to best defeat the voltage drops between traces and the noise and cross talk effects would be SINCERELY appreciated
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