Re: Solid State Relays and EMI
From: David Harper (dave.harper_at_gmail.com)
Date: 07/26/04
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Date: 26 Jul 2004 08:30:53 -0700
John Woodgate <jmw@jmwa.demon.contraspam.yuk> wrote in message news:<2ea4RJE4yNBBFwhG@jmwa.demon.co.uk>...
> I read in sci.electronics.design that Chris S. <chrisks@NOSPAMudel.edu>
> wrote (in <ce2dgg$aga$1@scrotar.nss.udel.edu>) about 'Solid State Relays
> and EMI', on Mon, 26 Jul 2004:
> >True, although it does mention semiconductors, and I can count the
> >number of semiconductors composed of moving parts on zero hands.
>
> Not any more. Consider the TI micro-mirror-matrix chips, for example,
> and solid-state microphones are appearing on the market, too.
That's more of a technicality. Those microphones use piezo-electric
effects, which is a function of [micro]strain.
Yes, technically the elements are moving a few microns (or less).
There's several "solid state" temperature sensors that experience far
more "movement" from thermal expansion than those microphones do.
They are not moving fractions of an inch (or more), like they are in
electro-mechanical devices.
Dave
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