Re: CE status of subassemblies

From: John Woodgate (jmw_at_jmwa.demon.contraspam.yuk)
Date: 03/11/05 

Date: Fri, 11 Mar 2005 11:38:41 +0000

I read in sci.electronics.design that PeteS <ps@fleetwoodmobile.com>
wrote (in <1110539650.282365.157220@g14g2000cwa.googlegroups.com>) about
'CE status of subassemblies', on Fri, 11 Mar 2005:
>Although, as John notes, there are no requirements for CE
>marking/testing of subassemblies designed to be embedded in OEM
>equipment, I can tell you (as one of those OEM designers) that if a
>product has been tested to CE standards and found to be compliant, I am
>far more likely to use it.
>Emissions are by far my biggest concern, but it's nice if the drop-in
>unit has had any other applicable testing. For instance, if the device
>has any pins that may connect to the outside world, have the various
>ESD and suscetibility tests been done? Such testing, although expensive
>and a royal pain on occasion make the unit much more marketable, in my
>experience.
>
Quite right, but the OEMs tend to have their own particular requirements
for these 'pre-tests', so it may not be appropriate to go into a
'generic' test programme before determining what clients actually ask
for. 

-- 
Regards, John Woodgate, OOO - Own Opinions Only. 
The good news is that nothing is compulsory.
The bad news is that everything is prohibited.
http://www.jmwa.demon.co.uk Also see http://www.isce.org.uk