Re: small soldering job

On Fri, 27 May 2005 08:08:35 +0100, the renowned Paul Burke
<paul@xxxxxxxxxx> wrote:

>Walter Harley wrote:
>
>> Yes, the ones with the metal on the bottom (TI's PowerPad, for instance) are
>> what make me think that sooner or later I'm going to have to figure out the
>> toaster oven method.
>
>I've mastered the FN(?) package, though it's fiddly. When laying out,
>put a hole in the base pad, large enough to get the tip of a fine bit
>through. Flux everything. Solder blob one corner pin, and anchor the
>component in place with that. Solder the other pins (fiddly). Then
>introduce solder through the underside hole gently, so it acts to
>conduct heat to the bottom pad. When it's ready, it wicks in, and all is
>OK. I've only tried it with quite small components, the LTC2601 being
>the smallest, but it works fine for them.
>
>Paul Burke

Hot air works okay for them too, at least for a few prototypes. I have
not tried a QFN44 or 28 yet, but they don't look too scary.



Best regards,
Spehro Pefhany
--
"it's the network..." "The Journey is the reward"
speff@xxxxxxxxxxxx Info for manufacturers: http://www.trexon.com
Embedded software/hardware/analog Info for designers: http://www.speff.com
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