Re: RoHS => tin whiskers?

Oliver Betz <OBetz@xxxxxxxxxxxxx> wrote:

Nico Coesel wrote:

[...]

http://www.national.com/packaging/leadfree/tin_whiskers.html

[...]

Tin whiskers are not fully understood yet but it is assumed they are
caused by tensions in the material caused by cooling down unevenly,
too fast or too slow. Some experimentation with the soldering oven
temperature profile should solve the tin whiskers problem. This may

That's rather hard since you don't have reliable information about the
interpretation of accelerated test data and you don't want to wait 10
years for data.

I doubt thats true. Every metal has 'issues' with crystal alignment,
so a lot is known on the subject in general. Take brass for instance.
If not properly heat treated after bending thin *** material, it
will get brittle and break.

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