Re: 320pin BGA Pin Layout suggestions
- From: "David L. Jones" <altzone@xxxxxxxxx>
- Date: 19 Mar 2007 04:59:29 -0700
On Mar 19, 7:35 pm, "Joe G \(Home\)" <j...@xxxxxxxxxxxxxxx> wrote:
Hi All,
I am looing at laying out 320pin BGA on a PCB like this one.
http://www.standardics.nxp.com/packaging/package.outlines/pdf/sot824-...
The pitch between balls is 0.5mm. The internal cpu speed is 220MHz but the
external I think is ~60MHz.
It has a JTAG port
Questions
Q1
How many PCB layers would you recommend and why
Might depend on (among other things) how many of those 320 pins you
are actually using.
I had to use a 900+pin BGA package once but only needed a few dozen I/
O.
You are lucky with that arrangement in that you have plenty of space
in the middle of the device for breaking out the inner pins. With any
luck you won't need two traces between any of the pads.
4 layer bare minimum of course depending on pin usage, with 6 or 8
layers being more likely and this will give you a lot more route and
power options.
Q2
Is there anything else I should watch out for?
Power decoupling and power plane usage.
Follow the manufacturers recommended guidelines precisely.
Dave.
.
- References:
- 320pin BGA Pin Layout suggestions
- From: Joe G \(Home\)
- 320pin BGA Pin Layout suggestions
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