Re: Wow, first lead-free victim: Microsoft Xbox 1 billion damage

Jan Panteltje <pNaonStpealmtje@xxxxxxxxx> wrote:

On a sunny day (Tue, 10 Jul 2007 20:13:10 GMT) it happened nico@xxxxxxxxxxx
(Nico Coesel) wrote in <4693e82c.142983559@xxxxxxxxxxxxxx>:

panteltje@xxxxxxxxx wrote:

On 10 jul, 19:55, n...@xxxxxxxxxxx (Nico Coesel) wrote:
Jan Panteltje <pNaonStpealm...@xxxxxxxxx> wrote:

Source (in German):
http://www.heise.de/newsticker/meldung/92447

They don't blame lead free soldering, but they blame poor thermal
design. The designers just cut too many corners.

Not exactly.

I am looking into this, and one aspect is teh higher surface tension
of lead-free solders (then SnPb),
A higher surface tension means it will ball itself together again if
heated

When heated? If a chip gets hot enough to melt the tin, you have a
different problem.

One thing mentioned on joystick.com was that the 'red ring of death' started after
a user started using the xbox on its side.
Maybe the chip just fell of?

There may be a dozen of reasons why this could happen. If a lot of
units have this problem the cause is either bad design or a production
process that has not been well controlled. It takes time and
experience to get a reflow oven to work well for a certain PCB. This
goes for both leaded and lead free soldering.

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