Re: Question for Win Hill

John Larkin jjlarkin@xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx posted to
sci.electronics.design:

On Sat, 18 Aug 2007 09:52:54 -0700, Jim Thompson
<To-Email-Use-The-Envelope-Icon@xxxxxxxxxxxxxxx> wrote:

On Sat, 18 Aug 2007 09:11:43 -0700, Winfield
<winfieldhill@xxxxxxxxx> wrote:

Jim Thompson wrote:
Winfield wrote:

What are you working on?

A specialized ASIC for high efficiency flyback
applications, but with a 1 cent die cost target :-(

I suppose you're joking, but seriously, how would
one work toward a penny-scale IC die, by making it
really, really small? I see the FQN1N60C you were
talking about costs 15 cents, qty 5k, from Mouser.
That's considerably cheaper than the same die in an
SMD package, so it appears that very high production
quantities are also required to get the price down.

No joke. Quantities exceeding 1 million.

We already have located a bipolar foundry which will do a 1mm X
1mm chip for 1¢.

...Jim Thompson

That's only $10K for a run of a million chips! What's that, 100
wafers? I bet your engineeering will cost a lot more, per chip,
than making them!

John

Lets see, 1 mm by 1 mm die on 200 mm circular wafer. 3/4 of 40,000
square mm; say about 30,000 dice per wafer. That would be 30
wafers, about half a boatload. NRE still dominates.
.

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