heatsinking a thermal padded IC ?
- From: Adam S <not.valid@nosuchaddress>
- Date: Mon, 24 Sep 2007 18:21:51 +1000
Normally any QFN packages and the like that need to dissipate heat will have a thermal pad designed to transfer heat from die to a copper ground plane via thermal vias. Is it possible to improve the thermal conductivity by adding a aluminum heatsink directly on the PCB surface opposite the QFN package ?
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