Re: prototyping with leadless surface mount

miso@xxxxxxxxx wrote:

I've done prototyping with surface mount components where the leads at
least reach the side of the package. I want to solder a part where the
leads are completely underneath the package. How do you do hand
assembly with such a package?

Solder up the pads, which you have designed to stick out from the
package far enough to put a soldering iron tip on. Place the item, and
reflow either one pin at a time or with hot air gun.

If the pads stick out a long way, you can set the item, drop the iron on
the outside of the pad, and feed solder between the pad and the device.
hold it down well so it does not shift while you do 2 pins at opposite
corners, then go back and do the rest of the pins. Don't use too much
solder.

If the pads don't stick out, you have to go to paste and reflow, I think.

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