Re: prototyping with leadless surface mount

On Feb 22, 11:06 am, qrk <SpamT...@xxxxxxxx> wrote:
On Thu, 21 Feb 2008 18:09:26 -0800 (PST), m...@xxxxxxxxx wrote:
I've done prototyping with surface mount components where the leads at
least reach the side of the package. I want to solder a part where the
leads are completely underneath the package. How do you do hand
assembly with such a package?

I use a waffle iron with flippable plates. One side of the plates is
for waffles, the other side of the plates are smooth for grilled
cheese sandwiches. I use the smooth sides. Stick the board in, shut
the lid, and in a minute or two your board should be ready. Put a dab
of solder paste on a unused pad so you can tell when the solder melts.
I've done those awful parts with thermal pads under the body using
this technique.

---
Mark

Do you think it's a good idea to have heat applied from the top?
.

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