Re: prototyping with leadless surface mount
- From: qrk <SpamTrap@xxxxxxxx>
- Date: Sat, 23 Feb 2008 19:13:28 GMT
On Fri, 22 Feb 2008 13:04:14 -0800 (PST), miso@xxxxxxxxx wrote:
On Feb 22, 11:06 am, qrk <SpamT...@xxxxxxxx> wrote:
On Thu, 21 Feb 2008 18:09:26 -0800 (PST), m...@xxxxxxxxx wrote:
I've done prototyping with surface mount components where the leads at
least reach the side of the package. I want to solder a part where the
leads are completely underneath the package. How do you do hand
assembly with such a package?
I use a waffle iron with flippable plates. One side of the plates is
for waffles, the other side of the plates are smooth for grilled
cheese sandwiches. I use the smooth sides. Stick the board in, shut
the lid, and in a minute or two your board should be ready. Put a dab
of solder paste on a unused pad so you can tell when the solder melts.
I've done those awful parts with thermal pads under the body using
this technique.
---
Mark
Do you think it's a good idea to have heat applied from the top?
You want to heat the board evenly as much as possible. The grill
doesn't contact the top of the board or any of the components. This
waffle iron technique has the advantage of creating a hot air cavity
which heats up the components and gets the job done fast. I've used
this method on a few of Linear Technology's DFN and QFN packages with
the thermal tab under the part and 0.5mm pin pitch.
---
Mark
.
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