Questions on PCB terminology



Hi there - I've been running across a lot of PCB terminology lately,
and thought I should make sure I'm not completely lost here:

NSMD vs. SMD pads: NSMD means that the hole in the solder mask is
larger than the copper pad, while SMD means the hole in the solder
mask is smaller than the copper pad.

blind via: via that only comes out one side of the PCB
buried via: via that does not come out either side of PCB

Tented via: via with soldermask covering entire hole and pad, can be
done on one or both sides
capped via: via that has the holes covered on the top and bottom
layers with copper (so that hole is not visible)
plugged via: via that is filled with some nonconductive material (what
kind of material is this?)
filled via: via that is filled with solder
encroached via: alot like a tented via, except that the hole is not
completely covered with soldermask - only the majority of the via pad
is covered with soldermask

How far off the mark am I on these? Can anybody give me an idea of
added cost to low quantity PCB runs of all of these via types? I am
mostly interested in how they'd effect runs of 4-8 layer PCBs that I'd
be purchasing in 10-50 unit quantities. Also - what is the idea behind
an encroached via? Is the idea that it's easier/cheaper to do than a
tented via, while being nearly as effective in keeping solder from
being wicked away from a surface mount pad?

Also - does anybody know of some master list that would explain all of
this terminology (and all that I'm leaving out) to me? Maybe a killer
book on the subject? I got my BSEE last May but this sort of stuff was
never even mentioned in my classes.

Thanks!

-Michael
.



Relevant Pages

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