Re: Utility of copper pours on four-layer boards
- From: Joerg <notthisjoergsch@xxxxxxxxxxxxxxxxxxxxx>
- Date: Tue, 08 Apr 2008 21:18:44 GMT
Joel Koltner wrote:
Hi Joerg,
"Joerg" <notthisjoergsch@xxxxxxxxxxxxxxxxxxxxx> wrote in message news:OKQKj.444$FF6.29@xxxxxxxxxxxxxxxxxxxxxxxxxxxxxActually I often do have to go to layout without sims. I breadboard the most critical stuff but the remainder goes straight into CAD.
OK; I still expect you're noticeably above average when it comes to not making mistakes.
Older, mostly :-)
But yes, with age comes experience from the numerous bloody noses one got in the past. Such as to avoid LDOs like the plague. Just one of those can cause a lot of grief on a design that was only simulated and not breadboarded.
Ouch! The switch to TQFP was a smart move, I'd have stayed with that.
The final product didn't have the space for it, otherwise we (probably) would have.
I try to avoid BGA wherever I can.
Oh, he did mind.
Hmm... yeah, I suppose he did; it would seem to hinge on how much he knew of what was going to happen next, perhaps.
He knew all of that and had told the others. Yet many of them still didn't get it. Thomas was by far not the only one in doubt.
--
Regards, Joerg
http://www.analogconsultants.com/
.
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- From: Joel Koltner
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- Re: Utility of copper pours on four-layer boards
- From: Joel Koltner
- Re: Utility of copper pours on four-layer boards
- From: Joerg
- Re: Utility of copper pours on four-layer boards
- From: Joel Koltner
- Re: Utility of copper pours on four-layer boards
- From: Joerg
- Re: Utility of copper pours on four-layer boards
- From: Joel Koltner
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- From: Joerg
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- From: Joel Koltner
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