Re: Heatsink for DPAK
- From: Pasquale <desmomito@xxxxxxxxxxxx>
- Date: 28 May 2008 17:59:47 GMT
On Wed, 28 May 2008 10:30:55 -0700, Tim Shoppa wrote:
On May 28, 7:48 am, "David L. Jones" <altz...@xxxxxxxxx> wrote:
You may have a bit of trouble soldering this by hand. They are designed
for reflow soldering.
True, that's what they're designed for, but for a part with a pad more
than a few mm by a few mm (for example the TO-252 has a pad 6.5 x 6 mm,
quite big by most SMT standards) I find that a plated-through hole big
enough for my soldering iron tip lets me do a very decent job of getting
the part attached to the board. I'm sure there's some loss off cooling
ability because there's no copper under part of the pad but I'm not
pushing the limits.
Tim N3QE
I'm really interested in what you have done. Could you, please, send me
some pics or something in order to understand better ? Or some links
where I can check your procedure ?
Thank you,
Pasquale.
.
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