Re: Heatsink for DPAK



On 28 May 2008 12:53:34 GMT, Pasquale <desmomito@xxxxxxxxxxxx> wrote:

You may have a bit of trouble soldering this by hand. They are designed
for reflow soldering.
What equipment do you have available?

Actually I don't have really good equipment (I have the stuff to solder
by hand, "regular" equipment), for sure I don't have a reflow solder
station. I know that is gonna be difficult but how can I manage to solder
it by using "regular" equipment ? I need suggestions in order to get the
best result with the equipment I have.

I had a similiar question a while ago heres what I did. It's not ideal
but it worked.The poor mans reflow method.

All I do is put a dab of solder on the draintab of the mosfet,and some
solder on the drain portion of the footprint.Press the mosfet down and
heat the drain tab at the same time.Keep going around heating the
drain tab that extends above the case,and the drain part of the
footprint.I used a small insulated screwdriver to keep pressure on the
FET,while heating.

It took a few tries to get it down, but once you get the feel for
it,it does the job in a resonable time.Just dont overdo the solder.

Good luck

BTW, have you done the thermal calculations to figure out what size
heatsink you actually need?

Not at all. I've seen some heatsink and I though to take the best one. I
know that it's not good choice but I don't have any idea about the
calculation. Could you help me ?


Thank you,
Pasquale.
.



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