Re: Overview Of New Intel Core i7(Nehalem) Processor

On a sunny day (Mon, 15 Jun 2009 08:29:10 -0700) it happened John Larkin
<jjlarkin@xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx> wrote in
<ttoc35tkr1888sbf4grd7bjeqss1utnpqc@xxxxxxx>:

[1] Which brings up an interesting point: electronic design
increasingly involves connecting ic's and boxes; we have moved up the
abstraction stack from the discrete tube and transistor days.
Software, in theory, also does a lot of connecting of standard boxes.

The difference is that an opamp has 3 active pins and comes with a
20-page datasheet. A DRAM has a 200 page datasheet, appnotes, and apps
engineers available to answer any questions. Most chips have eval
boards and free human support available.

I read some Windows module code. There's a standard form at the top of
every subroutine that the author is supposed to fill out. One field is
"Desciption of function" which was often filled out with useful info
like "What it says." So the documentation is the code itself.

That is not fair, ;-) you are using a failed project (windows) as
example, and on top of that it is in C++, so it can never even make
sense,


Imagine building a big system out of undocumented ICs.

When you compare stringing chips together with stringing software libraries
and programs together, then you will find that often the software also
has huge sets of documentation.
the chip vendor may not give you a fully detailed diagram, let
alone the mask of the silicon in the chip, but the datasheet shows
you all you need to know to use it.
I gave this project as example recently:
http://tcts.fpms.ac.be/synthesis/mbrola.html
I interfaced to it in my subtitle editor.
Although I do not exactly remember all the details, the documentation was quite simple,
and allowed me to write the C interface.
It is a clear example of connecting things at a high level.
Linux user are very familiar with the expression 'RTFM'.
There is your datasheet.
.

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