Re: Prototyping boards with small SMT components
- From: George Herold <ggherold@xxxxxxxxx>
- Date: Mon, 22 Jun 2009 20:12:26 -0700 (PDT)
On Jun 22, 3:37 pm, d...@xxxxxxxxxxxxxx (Don Klipstein) wrote:
Does anyone here besides me hand solder SMT components onto boards for
development and prototype purposes?
I have developed a trick that lets me solder 0603 size (metric 1608)
components. I can even solder 0402 (metric 1005) components, but not
many because it takes more effort.
My trick: I apply rubber cement to the edge of a fingernail, put the
component on the benchtop near the board, land my fingertip near the
component with the gluey fingernail edge over the component, and roll my
finger on its tip to get the component to stick to my fingernail. Next, I
land my fingertip on the board with the component over where it goes, and
roll my finger on its tip to place the component on the board. Then I
tack it in place with a fine soldering iron tip. After that, I solder
more properly the other end, then touch up the solder joint on the first
end.
I can solder SOT23 parts that way.
I find SOIC / SOP ICs large enough to position without the rubber cement
trick, but it is sometimes a pain getting them positioned correctly. If
the IC moves or is not yet in place, some or most of the leads like to
fall into the slight valleys between the pads. When that happens, I
sometimes find it hard to slide the IC into position from that situation,
and then I have to lift it and try again placing it.
Does anyone else do this? Does anyone else here have a different way of
placing and soldering SMT components?
Is there any hope of hand soldering ICs more compact than SOIC?
I know someone who uses solder paste and a clothes iron, but that
did not work for me. (Different clothes iron needed?) He also does not
solder components smaller than 1206, since that is the minimum size he can
move with a suction lifter device that he made.
- Don Klipstein (d...@xxxxxxxxx)
I like to 'lightly' tin one pad. Place the component (with a nice
stero microscope) hold down with tweezers and apply heat to tinned
pad. If placement isn't good lift and try again.
If placement is OK, then solder other pins and reflow first solder
joint.
George H.
.
- References:
- Prototyping boards with small SMT components
- From: Don Klipstein
- Prototyping boards with small SMT components
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