Re: Most interesting recent products / improvements?

Joerg wrote:

Small ones can be ok but large BGA cannot easily stand the flexing of a
circuit board. All it takes is one fall. BGA don't have any compliance
to speak of while the leads of TSSOP and others can bend a little
without popping out of the solder.

I think this depends on the application. A one mm thick mobile phone size
FR4 board should not flex very much and maybe for bigger boards you could
use more screws, but you might be right for the baking tray size boards you
do, used in Ariane rockets and similar things :-)

--
Frank Buss, fb@xxxxxxxxxxxxx
http://www.frank-buss.de, http://www.it4-systems.de
.

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