Re: Soldering surface mount components

From: Mark (UK) (jumbos.bazzar_at_btopenworld.com)
Date: 06/08/04 

Date: Tue, 8 Jun 2004 22:30:33 +0000 (UTC)

Hi!

How I do it, is once the chip is removed, and you've got the bare pads,
I then use a regular iron set to a low temp, 275-300, to go over the
pads with fresh LMP solder and lots of flux, that tinns them up,the flux
helps stop them joining together, and leaves solder on each pad to help
solder the new IC legs to. Then use a hot air pencil to finally solder
the chip in place.

Yours, Mark.

Mariano wrote:
> "Charles Schuler" <charleschuler@comcast.net> wrote in message
> news:PPWdnXrQkMHKvlvd4p2dnA@comcast.com...
>
>
>>1/ Magnification
>>2/ Liquid flux and solder paste
>
>
> How do you apply the solder paste manually to the IC pins or pads ? I've
> tried and the paste does not stick anywhere (before soldering). I even tried
> with a syringe and ended up clogging the needle.
>
> IMO this is the most critical part in SMD. It doesn't matter if your
> placement is poor, since the solder will try to align the components with
> the pads (when soldering). But you need to apply an even coat (and right
> quantity) of paste to each pad. This is were I fail.
>
>
>>3/ Hot air soldering device
>>4/ Practice and patience
>
>
>
>

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