chip swelling up and getting fried

From: DJ (deepakjnath_at_rediffmail.com)
Date: 07/14/04 

Date: 14 Jul 2004 04:48:08 -0700

Hi all,
   I am stuck with this problem of a BGA chip getting fried within a
few seconds of powerup.The chip takes in 2 power supplies.1v for core
and a 3v3 for i/o's.There are no overshoots or undershoots that i can
see in the oscilloscopes.
The chip has worked on the same board for sometime but eventually gets
burned out or swelling in the package is seen.I have done the power
sequenceing as per the manufactures requirement but still having major
problems.
I have exhausted all the options i can look into......please help me
start looking for some thing that can lead me to the problem.
Can someone tell me where the likly problem can be?.
 The CMOS chip works for a few seconds but goes on getting hot till
the swelling appears and then the chip is dead.It has a plastic
package.The chip has a PCI interface.will the overshoot on the signals
damage the chip so badly?

Regards
DJ

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