Re: chip swelling up and getting fried

From: Bob F. (bobf_at_phantom.com)
Date: 07/14/04 

Date: Wed, 14 Jul 2004 09:16:34 -0500

"DJ" <deepakjnath@rediffmail.com> wrote in message
news:92f2a1e7.0407140348.11b7629c@posting.google.com...
> Hi all,
> I am stuck with this problem of a BGA chip getting fried within a
> few seconds of powerup.The chip takes in 2 power supplies.1v for core
> and a 3v3 for i/o's.There are no overshoots or undershoots that i can
> see in the oscilloscopes.

Have you bothered to measure the current being drawn by this device? Take a
look at the data *** and see what the expected power consumed by the
device should be then check to see how much power it is consuming in your
design. Remember, current measurements are made by connecting the DVM in a
serial connection.

What is the device? How many bumps does it have? Double check your
design/layout to ensure that all of the inputs/outputs are correctly pulled
up or pulled down according to the MFG's guidelines.