Re: Cutting TiO2(110) wafer
- From: Greg Hansen <glhansen@xxxxxxx>
- Date: Sun, 26 Nov 2006 09:57:03 -0600
Ant wrote:
andy everett schrieb:
Ant wrote:
Hi!
I've got a TiO2(110) wafer for my STM experiment but it seems to exceed the allowed sample size. Now I need to cut it, but as far as I know, the cleavage is easy only in one direction, i.e. parallel to (110) plane.
The wafer is 0.5 mm thick. Does anybody know how to cut it without destroying completely the wafer? Any help is greatly appreciated.
Regards, Antoni Rok
http://tinyurl.com/y9fmh8
Thank you for your advice. Is it possible to cut crystal with diamond wheel without polluting the surface? Do you know what will happen if I make a scratch on the surface and try to break the wafer?
Regards, AR
I've worked with people who used cut silicon crystals routinely. I don't know if there was foreign matter left, but certainly there were surface stresses. They removed the surface layer by etching in "witch's brew", which, as I recall, is a mixture of hydrofluoric acid, nitric acid, and acetic acid. Very nasty stuff, read the MSDAs before beginning. I don't know what would etch TiO2.
.
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