High-resolution X-ray microscope provides insight into nanotechnology

Heise Online http://atu.ca/2686

A new type of microscope developed by a Swiss team from the
Paul Scherrer Institute (PSI) and the EPFL Lausanne
combines the high penetration power of X-rays with high
spatial resolution. This should, for the first time, allow
the tiniest internal structures of semi-conductors and
cells to be imaged.

Using a PILATUS megapixel detector, it is possible to
precisely count millions of individual X-ray photons. This
makes it possible to record detailed refraction patterns
from a sample whilst it is raster-scanned though the focal
spot of the beam. Normal raster scans measure only the
total absorption; another limitation is that they are only
able to image surfaces, whereas the new technique provides
an insight into internal structures.

The many thousands of diffraction patterns are combined
into a transmitting X-ray microscope image using an
algorithm developed by the Swiss research team. As well as
the sample data, the algorithm takes into account the
precise shape of the X-ray beam.

The new technique will help discover defects in semi-
conductor structures and improve standard microscopy
techniques.

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